Technical Articles

Laser cutting is a key step in lithium-ion battery production, requiring both high speed and precision to ensure safety and meet manufacturing demands. This study demonstrates high-quality, …

Laser cutting and drilling can be key to reaching the higher levels of miniaturization required for advanced packaging methods, including System-in-Package (SiP) technology.

USP lasers - with burst mode in particular - signifcantly enhace key proceses for componeents used in electric vehicle production.

Laser marking is a highly versatile tool for cost-effective, high throughput marking in many converter applications. UV lasers extend the utility of this process to a broader range …

Silicon Carbide (SiC) materials, used in power electronics for e-mobility, photovoltaics, and power storage, have processing challenges addressed by advanced micromachining lasers, …

A UV femtosecond laser with pulse-on-demand (POD) capability combines with high-speed galvos for position synchronized output (PSO) processing for high throughput and excellent qua …

The production of printed circuit boards (PCBs) requires a wide variety of processes, many of which are now performed using lasers. As the diameters of the vias required are becoming …

Spectra-Physics laser sources have been integrated into WaveLight^® FS200 femtosecond laser systems for over ten years.

System in package (SiP) singulation cut quality has become increasingly important. Using a green picosecond laser, we demonstrate excellent high-speed cutting of glass-reinforced epoxy …

We demonstrate cutting of a foldable OLED display cover window multi-layer stack with a high-power picosecond UV laser.

In this European research collaboration article, we demonstrate sub-400fs pulses with excellent beam quality at an average power of 1 kW using a high-power Spirit laser amplified with …

Flexible and foldable OLED displays require new protective cover materials. We present results for cutting thick, transparent, flexible multi-layer stacks using a high power UV ultrashort …

Polymer materials are increasingly important for medical device, flat panel display and microelectronics applications. We present micromachining results for polymers processed with …

When extremely high-quality machining is required, high power fs laser ablation has become a useful alternative to conventional non-laser processes such as milling, grinding and electric …

The influence of the laser process parameters on the efficiency and quality of the machining of bioabsorbable materials using High Q Spirit™ femtosecond laser system is presented.

Shape-memory alloys and in particular, nitinol, have revolutionized the market for implantable medical devices such as stents. In this article, we present femtosecond laser results …

Minimizing the temporal jitter in ultrafast oscillator systems is key to successful pump-probe spectroscopy. Recently, synchronization between two independent oscillators has been applied …

Using Spectra-Physics state-of-the-art ultrashort pulse laser technology, provides both high pulse energy and high average power, both of which are attractive to industry, processing …

The Ti:Sapphire laser has an important role in imaging, spectroscopy and many other applications.

Thin film panel technology count on laser systems as a critical piece of inline production systems.