Application Notes

App Note 75: The IceFyre^® FS IR200 femtosecond laser achieves exceptional polycrystalline diamond ablation by using burst-mode operation, which splits a high-energy pulse into multiple sub-pulses. This approach more than doubles ablation efficiency, delivering material removal rates above 21 mm³/min while maintaining excellent surface quality. With >200 W average power, >200 µJ pulse energy, and <500 fs pulse width, the IR200 combines high throughput with precision, making it a powerful tool for next-generation ultrafast micromachining of ultrahard materials.

App Note 74: This application note compares UV nanosecond and IR femtosecond lasers for silicon carbide (SiC) ablation, addressing machining challenges in EV and power electronics applications. It examines the impact of pulse width, fluence, and burst tailoring on removal rates and surface quality. UV ns lasers offer cost-effective results, while IR fs lasers—especially with burst mode—deliver higher efficiency. Burst control is identified as a key factor in optimizing SiC laser machining.

App Note 73: The application note explains that TOPCon solar cells are more efficient but use a lot of silver, which is costly and unsustainable.  It suggests using lasers to create precise openings for copper plating as a better alternative. This method reduces costs, improves performance, and is more scalable for future solar cell production.

App Note 72: Laser machining copper with speed and quality can be challenging. This application note demonstrates how UV nanosecond pulse bursts achieve optimal results.

App Note 71: Silicon carbide is critical for e-mobility but is difficult to process. Here we demonstrate ps UV pulses and TimeShift^™technology combining for high-quality SiC scribing with enhanced material removal rates.

App Note 70: Lithium-ion batteries are essential in industries like electronics, electric vehicles, and energy storage. Laser processing ensures high cutting speed and precise edge quality.

App Note 69: When drilling flex PCB blind vias in copper/polyimide laminates, TimeShift^™pulse tailoring overcomes the challenge of processing dissimilar materials, achieving excellent quality and high throughput.

App Note 68: Machining ceramics can be challenging, but a 70-Watt green nanosecond laser proves highly capable in meeting todays demanding quality and throughput requirements.

App Note 67: A UV femtosecond laser with pulse-on-demand (POD) capability combines with high-speed galvos for position synchronized output (PSO) processing for high throughput and excellent quality.

App Note 66: With high power across a range of high repetition rates, green nanosecond pulsed lasers easily slice through flex PCB laminates for high-speed yet cost-effective profile cutting.

App Note 65: Here we demonstrate the cutting of small-radius corners in high-index glass and reduced edge roughness with flexible pulse tailoring using TimeShift™ for process fine tuning.

App Note 64: We present results for using high-power UV femtosecond pulses to cut a complete smartphone OLED display, with speeds approaching 160 mm/s and heat-affected zones of just 5-10 µm.

App Note 63: PCB manufacturing is a rapidly evolving application space for lasers, with new materials and processes overlapping those already established. We find that a green nanosecond laser—with a high power output over a range of several hundred kHz pulse frequency—offers impressive speed and quality when cutting both a traditional thick FR4 substrate as well as a newer and thinner system in package (SiP) multilayer material.

App Note 62: System in package (SiP) singulation cut quality has become increasingly important. Using a green picosecond laser, we demonstrate excellent high-speed cutting of glass-reinforced epoxy laminate substrate materials with clean ablation of fiber end faces and embedded copper traces without delamination.

App Note 61: Industrial UV lasers are use a wide range of marking and engraving applications, including consumer electronics, medical devices, semiconductors, food and beverage, and other industrial manufacturing. With a high-energy, compact pulsed UV laser, the Explorer One HP HE, we demonstrate high-contrast, high-speed marking and engraving of silicon wafers, ceramics, transparent plastics, stainless steel and aluminum.

App Note 60: The cut quality of lithium-ion battery foils is of particular importance since flaws in the cut edge can lead to shorting and device reliability issues. We demonstrate high-quality, high-speed cutting of coated and bare cathode and anode foils using a picosecond laser. We find that burst-mode processing results in higher throughput and improved cut quality than single-pulse processing.

App Note 59: With a high power femtosecond UV laser, we demonstrate fast, high-quality cutting of various polymers used in OLED displays, flexible PC boards, microelectronics, medical devices, batteries, and other applications.

App Note 58: High-speed, high quality cutting of 5G flex PC board materials is demonstrated using an 80W UV Quasar(R) hybrid fiber laser. Materials include bare and copper-clad liquid crystal polymer (LCP).

App Note 57: Polymers play a vital role in various technology sectors, and ultrashort pulse lasers can process polymers with minimal heat-affected zone (HAZ) damage. We have conducted a comprehensive ablation phenomena study using a high-power femtosecond laser and have applied this information to optimizing full-cutting processes with both single and multi-pass approaches.

App Note 56: Using IceFyre high power picosecond 355 nm hybrid fiber laser for ablation cutting of a clear PI-based multi-layer stack for foldable display cover window application.