Application Notes

Application Note

New Materials in 5G Flex Circuits Process with Picosecond UV Lasers

App Note 55: Drilling and cutting of modified polyimide (MPI) and liquid crystal polymer (LCP), materials used in 5G flexible printed circuits (FPCs), are demonstrated using the IceFyre …

Application Note

High Quality Cutting of Thin Glass and Sapphire with Icefyre® ps Laser

App Note 54: Bessel beam optics produce a short Bessel region from the output of an IceFyre® 1064-50 picosecond laser to process thin glass & sapphire.

Application Note

Nitinol Machining for Precision Applications Using Spirit® Femtosecond Lasers

App Note 53: With its short pulse widths and high pulse energies, the Spirit HE 1040-16 industrial fs laser offers optimal laser parameters for processing a range of Nitinol thicknesses …

Application Note

Glass Micro-Welding with Picosecond Lasers

App Note 52: Using the IceFyre ps IR laser system, an optimized welding process could be developed for different material combinations.

Application Note

OLED Materials Processing with High Power UV Picosecond Lasers

App Note 51: Manufacturing of flexible organic light-emitting diode (OLED) displays is critical for next-generation consumer electronic devices, including foldable phones.

Application Note

Polycrystalline Diamond Machining with Femtosecond Bursts

App Note 50: When extremely high-quality machining is required, high power fs laser ablation has become a useful alternative to conventional non-laser processes such as milling, grinding …

Application Note

Processing Flexible Printed Circuit and Microelectronics Materials with UV ns Lasers

App Note 49: For high power UV ns material processing, the Talon® 355-45 laser delivers 45 Watts average power and >300 µJ pulse energy at 150 kHz pulse repetition frequency.

Application Note

Marking of Food and Beverage Products in High Throughput Production Lines

App Note 48: Some plastic materials exhibit photochemical color change only for UV wavelengths, while with IR lasers marking contrast is poor.

Application Note

High Quality Flex Printed Circuit (FPC) Processing with UV ps Lasers

App Note 47: The goal of the tests was to determine throughput and quality for processing the FPC materials and optimized process parameters.

Application Note

High Quality, High Throughput Glass Processing with the IceFyre® ps Laser

App Note 46: We used a Bessel beam optical setup to shape the beam of an IceFyre 1064-50 laser to structure 700 µm thick aluminosilicate glass for subsequent mechanical cleaving.

Application Note

Precision Marking in Industrial Manufacturing with Pulsed UV Lasers

App Note 45: Precision laser marking has increasingly been utilized in diverse industrial manufacturing segments including microelectronics, semiconductor, and automotive sectors.

Application Note

PSO Motion Capability for Fast, Variable Speed Trajectory Processing

App Note 44: In order to produce high quality machining results, it is necessary to be able to fire the laser at a constant spatial, not temporal, separation at all stages of a motion …

Application Note

Fabrication of Highly Transparent Anti-Fogging Glass Surfaces

App Note 43: Fogging of glasses is a widespread and well-known problem still searching for a solution. It occurs on the surfaces of objects that are colder than their humid environ …

Application Note

Flexible OLED Manufacturing with High Power fs Laser

App Note 42: Flexible OLED structure consists of a multilayer stack of functional materials deposited on heat sensitive plastic films such as Polyimide (PI) and Polyethylene Terephthalate …

Application Note

Burst Machining of Copper and Stainless Steel with IceFyre® ps Laser

App Note 41: While picosecond lasers are commonly used to machine high bandgap materials such as glass and sapphire, they are increasingly being used to machine materials such as metals …

Application Note

Picosecond Laser Burst Machining of Silicon

App Note 40: Machining of silicon is important in various industries such as integrated circuit (IC) back-end processing, microelectronics packaging and photovoltaics manufacturing …

Application Note

High Speed Processing of Plastics with a 100 W fs Laser

App Note 39: Femtosecond lasers are capable of machining plastic materials with minimum heat affected zone (HAZ) and very precise control of the material removal.

Application Note

Processing of Ultrahard Materials at Superior Speed and Quality

App Note 38: The use of femtosecond (fs) pulsed lasers for machining of PCD is very promising due to the non-thermal nature of material removal and the possibility of structuring micron-scale …

Application Note

Micromachining Transparent, Brittle Materials

App Note 37: Transparent and/or brittle materials such as glass, ceramics, and crystals are historically difficult to machine with good quality and high throughput.

Application Note

Ceramic Scribing Using Talon® Pulsed UV and Green Lasers

App Note 36: Laser machining of ceramics is enabling applications that are not well-suited for conventional ceramic machining processes because of the requirement for smaller and more …

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