q-switched lasers

349/355 nm Q-Switched Lasers Selection Guide

ProductDescriptionPowerPulse EnergyPulse Width
Quasar
High power UV and green hybrid fiber lasers for fast precision micromachining
 
 
Power
>60 W
>45 W
Pulse Energy
>300 µJ @ 200 kHz
>225 µJ @ 200 kHz
Pulse Width
<2 ns to >100 ns
<5 ns to >100 ns
Talon
Disruptive cost-performance UV lasers
 
Power
>45 W
>30 W
>20 W
>15 W
>12 W
>11 W
>10 W
>6 W
Pulse Energy
>300 µJ @ 150 kHz
>300 µJ @ 100 kHz
>200 µJ @ 100 kHz
>300 µJ @ 50 kHz
>240 µJ @ 50 kHz
>275 µJ @ 40 kHz
>500 µJ @ 20 kHz
>120 µJ @ 50 kHz
Pulse Width
<40 ns
<25 ns
<25 ns
<25 ns
<25 ns
~50 ns
~40 ns
<25 ns
 
Explorer One
Compact and lightweight UV and green ns lasers
 
Power
>6 W
>4 W
>2 W
>800 mW
>800 mW
>300 mW
>120 mW
>60 mW
Pulse Energy
>60 µJ @ 100 kHz
>50  µJ @ 80 kHz
>25 µJ @ 80 kHz
>16 µJ @ 50 kHz
>80 µJ @ 10 kHz
>6 µJ @ 50 kHz
>120 µJ @ 1 kHz
>60 µJ @ 1 kHz
Pulse Width
<15 ns
< 15 ns
<8 ns
<10 ns
<15 ns
<15 ns
<5 ns
<5 ns
 

532 nm Q-Switched Lasers Selection Guide

ProductDescriptionPowerPulse EnergyPulse Width
Quasar
High power UV and green hybrid fiber lasers for fast precision micromachining
>95 W
>75 W
>475 µJ @ 200 kHz
>375 µJ @ 200 kHz
TimeShift pulse flexibility,
<2 ns to >100 ns
<5 ns to >100 ns
Talon
Disruptive cost-performance UV lasers
 
Power
>40 W
>20 W
~15 W
Pulse Energy
>400 µJ @ 100 kHz
>400 µJ @ 50 kHz
~1000 µJ @ 15 kHz
Pulse Width
<25 ns
<25 ns
25-40 ns
 
VGEN-G
High repetition rate with tunable short pulse width for fine materials processing
 
Power
>30 W
>20 W
>10 W
Pulse Energy
>180 µJ
>100 µJ, >180 µJ
>100 µJ, >180 µJ
Pulse Width
3 to >50 ns
 
Explorer One
Compact and lightweight UV and green ns lasers
 
Power
>5 W
>2 W
>2 W
Pulse Energy
>63 µJ @ 80 kHz
>40 µJ @ 50 kHz
>200 µJ @10 kHz
Pulse Width
<12 ns
<15 ns
<15 ns
 

1064 nm Q-Switched Lasers Selection Guide

Explorer
Reliable DPSS IR lasers
 
POwer
>2.5 W
Pulse Energy
>25 µJ @ 100 kHz
Pulse Widths
<12 ns
 

ITO laser patterning
TCO laser patterning
LDP/LDI, repairing LCD/PDP, and PDP/AM OLED processing
Inside glass laser marking and titling
Hole drilling, cutting, and machining
Black matrix patterning
Via hole laser drilling
Flex circuit laser cutting (coverlay cutting) and laser drilling
PCB laser singulation
Laser ablation of material on PCBs and PCB structuring
Electronic package laser singulation
Ceramic laser scribing
Laser drilling ceramic foils
Laser scribing and laser dicing of wafers
Low K dielectric laser scribing and laser grooving
Laser marking of wafers
Die attach film (DAF)
TSV (through silicon via) laser drilling
Electronic package singulation (micro-SD, QFN, FBGA and DCA)
Laser scribing and laser dicing of sapphire, GaAs, GaN
Laser liftoff
Memory repair
Thin film P1, P2, P3 layer laser scribing, a-Si TF laser scribing, Mo-Si TF laser scribing
Laser doping of selective emitters (LDSE), c-Si laser processing
Laser doping of emitters using PSG as doping precursor
Metal wrap through (MWT) laser drilling
Emitter wrap through (EWT) laser drilling
c-Si solar cell edge isolation, c-Si laser processing
Laser grooved buried contacts (LGBC)
Laser scribing of silicon nitride
Laser defect/shunt repair
c-Si wafer marking
c-Si solar cell laser-fired contacts (LFC)
Stereolithography (exposure/ablation)
Marking
Metals, plastics
Deep/fine engraving
Metals, polymers, ceramics, glass
MALDI mass spectrometry
Laser microdissection
Molecular uncaging
LIDAR and LADAR
Range finding
Mobile LIDAR applications