fiber lasers

Spectra-Physics, through its acquisition of V-Gen in Tel Aviv, manufactures high quality fiber lasers for precision micromachining, marking and LIDAR applications.
Spectra-Physics’ portfolio of fiber lasers covers IR to UV and pulsed to lower power CW.

ProductDescriptionPowerPeak PowerPulse EnergyPulse Width
VGEN-ISP-POD
Exceptional functionality pulse-on-demand (POD) MOPA fiber laser
>75 W
>50 W
>30 W
>20 W
>20 kW
>25 kW
>15 kW
>15 kW
>1000 µJ
>1000 µJ
>1000 µJ
>1000 µJ
3 to 250 ns
3 to 250 ns
3 to 250 ns
3 to 250 ns
 
VGEN-SP
High peak power and narrow linewidth for high performance in LIDAR and range-findings applications
>20 W
>10 W
>20 W
>10 W
>25 kW
>25 kW
>40 kW
>40 kW
>75 µJ
>75 µJ
>100 µJ
>100 µJ
<3 ns  
VGEN-ESP
Mobile / Eye safe pulsed fiber laser for LIDAR and range-findings applications
>5 W >15 kW NA  3 ±0.5 ns  
ProductDescriptionPowerPulse EnergyPulse Width
Quasar
Highest power hybrid fiber laser with TimeShift pulse flexibility for high speed, quality micromachining
 
Power
>95 W
>75 W
Pulse Energy
>475 µJ
>375 µJ
Pulse Width
TimeShift pulse flexibility,
<2 ns to >100 ns
Plus pulse shaping and Burst Mode
 
new
VGEN-G
High pulse repetition rate with tunable short pulse width for fine material processing
new
 
Power
>30 W
>20 W
>10 W
Pulse Energy
>100 µJ,
>180 µJ
Pulse Width
3 to >50 ns (preset values)
 
ProductDescriptionPowerPulse EnergyPulse Width
Quasar
Unprecedented UV power (>60 W and >300 µJ) hybrid fiber laser with TimeShift pulse flexibility for fastest precision micromachining
 
Power
>60 W
>45 W
Pulse Energy
>300 µJ @ 200 kHz
>225 µJ @ 200 kHz
Pulse Width
TimeShift pulse flexibility,
<2 ns to >100 ns
Plus pulse shaping and Burst Mode
 

Fiber Laser Applications

Marking
Metals, plastics
Deep/fine engraving
Metals, polymers, ceramics, glass
Glass cutting
Vacuum hole drilling
LDP/LDI and PDP/AM OLED processing
ITO patterning
Via hole drilling
Flex circuit cutting, drilling
PCB laser singulation
Laser ablation of material on PCBs and PCB structuring
Electronic package laser singulation
HDI scribing
Ceramic scribing
Drilling ceramic foils
TSV (through silicon via) laser drilling
Laser scribing and dicing of wafers
Low K dielectric laser scribing and grooving
Silicon micromachining
Laser scribing of sapphire, GaAs, GaN
c-Si laser doping using PSG as precursor
c-Si solar cell laser scribing
Laser drilling of Metal Wrap Through (MWT) and Emitter Wrap Through (EWT) via holes
LIDAR and LADAR
Range finding
Mobile LIDAR applications