Applications

Specifications

Explorer 1064-3 Specifications

Explorer 1064-3
Wavelength 1064 nm
Gain Medium Nd:VYO4
Pulse Energy2,3 25 µJ
Output Power2 >2.5 W
Pulse Width (FWHM) <12 ns
Pulse-to-Pulse Stability (1 σ, absolute value)2 <2%
Long Term Stability (rms) <2%
Repetition Rate Single shot to 150 kHz
Spatial Mode M2 <1.3, TEM00
Beam Diameter, at waist (1/e2) 0.28 mm ±10%
Beam Divergence, full angle (1/e2) 6 mrad ±10%
Warm-up Time (cold start to >95% full power) <10 min
Polarization Ratio >100:1 (vertical)
Operating Voltage 24 VDC ±2 V
Maximum Inrush Current <4 A
Maximum Power Consumption <75 W
Typical Power Consumption <50 W at 25°C
Laser Head Thermal Heat Dissipation <50 W

Operating Temperature

Explorer 1064-3
Laser Head 18-35°C (<80% relative humidity)
Power Supply 18-35°C (<80% relative humidity)
Storage Temperature Range -20 to 60 °C (<90% relative humidity, non-condensing)

Dimensions (L x W x H)

Explorer 1064-3
Laser Head 6.50 x 3.74 x 2.13 in (165 x 95 x 54 mm)
Power Supply 6.46 x 5.12 x 2.56 in (164 x 130 x 66 mm)
Cable-Laser Head 2 m

Static Alignment Tolerance

Explorer 1064-3
Beam Position <±0.25 mm
Beam Angle <±1 mrad

Footnotes:

  1. Due to our continuous product improvement program, specifications may change without notice.
  2. Repetition rate at 100 kHz.
  3. Maximum power energy up to 50 µJ from single shot to 30 kHz.

Features

Exceptional Versatility

The compact Explorer laser delivers exceptional versatility. Customers can interface with the Explorer L-Series power supply either through RS 232 software interface or via analog TTL control signals. Sophisticated software algorithms, such as Burst Mode and First-Pulse Suppression, and supporting multiple software command sets ensure straight forward product integration. Finally, the Explorer system’s rugged design enables integrating the compact laser head into a motion control system to simplify complex optical layouts.

The Explorer 1064 nm Vanadate-based (Nd:YVO4) laser provides more than 2.5 W power and is targeted for memory repair, selective ablation in thin film processes and marking applications.