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Technical Article

Compact UV Laser Drives High‑Precision 360° Laser Wire Stripping

Laser Wire Solutions built the Odyssey‑8 to deliver precise 360‑degree wire stripping where mechanical methods fell short. Its performance comes from the MKS Spectra‑Physics Explorer ...
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Technical Article

Innovations in Li-ion Battery Electrode Structuring

Advances in Li ion battery electrode structuring continue to reshape what’s possible in next generation energy storage. From new manufacturing approaches to smarter ways of ...
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Technical Article

Optimizing ABF Drilling with Picosecond Lasers

How picosecond laser "burst-on-the-fly" drilling can solve one of advanced packaging’s toughest challenges – high speed drilling of sub-20 µm microvias ...
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Technical Article

Laser Marking for Wide-Bandgap Semiconductors: Meeting the Demands of SiC and GaN

SiC and GaN are advancing power electronics and require updated laser‑marking methods. Our compact Spectra‑Physics® Explorer® One ...
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Technical Article

Multiphoton Microscopy Provides a Deeper View of the Aging Brain

Longer‑wavelength ultrafast lasers are pushing the boundaries of multiphoton microscopy, allowing researchers to peer deeper into white matter and uncover how neurovascular changes ...
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Technical Article

Lasers Illuminate the Roadmap for Advanced Packaging

Low‑K dielectrics are critical to heterogeneous computing that powers AI, HPC, 5G, and autonomous vehicles, but their fragility creates major hurdles in wafer singulation, scribing, ...
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Application Note

High‑Precision SiC and GaN Marking with the Explorer® One Compact UV Nanosecond Laser

App Note 76: The Explorer One HP HE 355-200 compact UV nanosecond laser delivers high‑contrast, low‑damage SiC and GaN marking for advanced semiconductor manufacturing.
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Application Note

Enhanced PCD Ablation with the IceFyre FS IR200 Femtosecond Laser Using Burst-Mode Operation

App Note 75: The IceFyre® FS IR200 femtosecond laser achieves exceptional polycrystalline diamond ablation by using burst-mode operation, which splits a high-energy ...
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Application Note

Ablation Efficiency in Silicon Carbide Comparing UV Nanosecond and IR Femtosecond Laser Technologies

App Note 74: This application note compares UV nanosecond and IR femtosecond lasers for silicon carbide (SiC) ablation, addressing machining challenges in EV and power electronics ...
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Application Note

Laser Contact Opening (LCO) + Plating as a Sustainable Solution for TOPCon Solar Cells

App Note 73: The application note explains that TOPCon solar cells are more efficient but use a lot of silver, which is costly and unsustainable.  It suggests using lasers ...
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Application Note

Copper Micromachining Enhanced by Programable UV Nanosecond Pulses

App Note 72: Laser machining copper with speed and quality can be challenging. This application note demonstrates how UV nanosecond pulse bursts achieve optimal results.
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Application Note

SiC Scribing with High-Power ps Lasers and the Advantages of TimeShift

App Note 71: Silicon carbide is critical for e-mobility but is difficult to process. Here we demonstrate ps UV pulses and TimeShifttechnology combining for high-quality ...
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Application Note

Fast Lithium-Ion Battery Electrode Cutting with High-Power Femtosecond Pulses

App Note 70: Lithium-ion batteries are essential in industries like electronics, electric vehicles, and energy storage. Laser processing ensures high cutting speed and precise edge ...
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Application Note

Material-Specific Ablation Profiles Simplify Fast Drilling of Flex PCB Microvias

App Note 69: When drilling flex PCB blind vias in copper/polyimide laminates, TimeShiftpulse tailoring overcomes the challenge of processing dissimilar materials, achieving ...
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Application Note

Cutting and Scribing Alumina Ceramic with High-Power Green DPSS Lasers

App Note 68: Machining ceramics can be challenging, but a 70-Watt green nanosecond laser proves highly capable in meeting todays demanding quality and throughput requirements.
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Technical Article

On the Road to Sustainable Clean Energy Tech, a Laser-Based Method Rises to the Fore

Laser contact opening (LCO) + plating delivers TOPCon solar cells with higher efficiency at lower cost – and ultrashort-pulse UV lasers are the key technology that makes LCO ...
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Application Note

Femtosecond Pulses Combine with PSO Technology for Excellent Quality and High Throughput

App Note 67: A UV femtosecond laser with pulse-on-demand (POD) capability combines with high-speed galvos for position synchronized output (PSO) processing for high throughput and excellent ...
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Technical Article

Optimizing Laser Cutting in Semiconductor Advanced Packaging

Lasers play a critical role in enabling the advanced electronic packaging that powers AI and high-performance computing. In our latest Tech Briefs article, we explore how to choose ...
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Application Note

Fast Flex-PCB Cutting with Green Nanosecond Pulsed Lasers

App Note 66: With high power across a range of high repetition rates, green nanosecond pulsed lasers easily slice through flex PCB laminates for high-speed yet cost-effective profile ...
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Technical Article

Laser Light Enables Digital Twin Technology in Cardiology

Hi-D Imaging uses MKS technology for optical hemodynamics measurements.
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