Technical Articles

SiC and GaN are advancing power electronics and require updated laser‑marking methods. Our compact Spectra‑Physics^® Explorer^® One^™ HE 355 200 UV laser delivers high‑contrast, precise marks in a single pulse with scalable depth.

Longer‑wavelength ultrafast lasers are pushing the boundaries of multiphoton microscopy, allowing researchers to peer deeper into white matter and uncover how neurovascular changes drive cognitive decline.

Low‑K dielectrics are critical to heterogeneous computing that powers AI, HPC, 5G, and autonomous vehicles, but their fragility creates major hurdles in wafer singulation, scribing, and drilling.

Laser contact opening (LCO) + plating delivers TOPCon solar cells with higher efficiency at lower cost – and ultrashort-pulse UV lasers are the key technology that makes LCO possible.

Lasers play a critical role in enabling the advanced electronic packaging that powers AI and high-performance computing. In our latest Tech Briefs article, we explore how to choose the optimal laser for precision material processing to support next-generation packaging technologies.

Hi-D Imaging uses MKS technology for optical hemodynamics measurements.

Ultrashort pulse (USP) lasers have revolutionized the machining of Nitinol for medical devices by enabling "cold ablation" that preserves the material's critical superelastic and shape memory properties, with optimal results achieved through careful calibration of pulse energy, repetition frequency, cutting speed, and assist gas selection.

Laser cutting is a key step in lithium-ion battery production, requiring both high speed and precision to ensure safety and meet manufacturing demands. This study demonstrates high-quality, high-speed cutting of graphite-coated copper anodes and NMC-coated aluminum cathodes using 200 W infrared femtosecond lasers. Temporal pulse shaping boosts cutting speed by up to 65%, with NMC cathode cutting exceeding 2.5 m/s while maintaining excellent quality.

Laser cutting and drilling can be key to reaching the higher levels of miniaturization required for advanced packaging methods, including System-in-Package (SiP) technology.

USP lasers - with burst mode in particular - signifcantly enhace key proceses for componeents used in electric vehicle production.

Laser marking is a highly versatile tool for cost-effective, high throughput marking in many converter applications. UV lasers extend the utility of this process to a broader range of materials, as well as heat-sensitive products.

Silicon Carbide (SiC) materials, used in power electronics for e-mobility, photovoltaics, and power storage, have processing challenges addressed by advanced micromachining lasers, which improve ablation efficiency, machining quality, and wafer singulation.

A UV femtosecond laser with pulse-on-demand (POD) capability combines with high-speed galvos for position synchronized output (PSO) processing for high throughput and excellent quality.

The production of printed circuit boards (PCBs) requires a wide variety of processes, many of which are now performed using lasers. As the diameters of the vias required are becoming smaller and smaller, lasers with UV NANOSECOND pulses are increasingly being used.

Spectra-Physics laser sources have been integrated into WaveLight^® FS200 femtosecond laser systems for over ten years.

System in package (SiP) singulation cut quality has become increasingly important. Using a green picosecond laser, we demonstrate excellent high-speed cutting of glass-reinforced epoxy laminate substrate materials with clean ablation of fiber end faces and embedded copper traces without delamination.

We demonstrate cutting of a foldable OLED display cover window multi-layer stack with a high-power picosecond UV laser.

In this European research collaboration article, we demonstrate sub-400fs pulses with excellent beam quality at an average power of 1 kW using a high-power Spirit laser amplified with a thin-disk multi-pass amplifier.

Flexible and foldable OLED displays require new protective cover materials. We present results for cutting thick, transparent, flexible multi-layer stacks using a high power UV ultrashort pulse laser, demonstrating a high quality and throughput process.

Polymer materials are increasingly important for medical device, flat panel display and microelectronics applications. We present micromachining results for polymers processed with a high-power femtosecond laser with single and burst pulses and at infrared and green wavelengths.