Application Notes

App Note 67: A UV femtosecond laser with pulse-on-demand (POD) capability combines with high-speed galvos for position synchronized output (PSO) processing for high throughput and excellent …

App Note 66: With high power across a range of high repetition rates, green nanosecond pulsed lasers easily slice through flex PCB laminates for high-speed yet cost-effective profile …

App Note 65: Here we demonstrate the cutting of small-radius corners in high-index glass and reduced edge roughness with flexible pulse tailoring using TimeShift™ for process fine …

App Note 64: We present results for using high-power UV femtosecond pulses to cut a complete smartphone OLED display, with speeds approaching 160 mm/s and heat-affected zones of just …

App Note 63: PCB manufacturing is a rapidly evolving application space for lasers, with new materials and processes overlapping those already established. We find that a green nanosecond …

App Note 62: System in package (SiP) singulation cut quality has become increasingly important. Using a green picosecond laser, we demonstrate excellent high-speed cutting of glass-reinforced …

App Note 61: Industrial UV lasers are use a wide range of marking and engraving applications, including consumer electronics, medical devices, semiconductors, food and beverage, and …

App Note 60: The cut quality of lithium-ion battery foils is of particular importance since flaws in the cut edge can lead to shorting and device reliability issues. We demonstrate …

App Note 59: With a high power femtosecond UV laser, we demonstrate fast, high-quality cutting of various polymers used in OLED displays, flexible PC boards, microelectronics, medical …

App Note 58: High-speed, high quality cutting of 5G flex PC board materials is demonstrated using an 80W UV Quasar(R) hybrid fiber laser. Materials include bare and copper-clad liquid …

App Note 57: Polymers play a vital role in various technology sectors, and ultrashort pulse lasers can process polymers with minimal heat-affected zone (HAZ) damage. We have conducted …

App Note 56: Using IceFyre high power picosecond 355 nm hybrid fiber laser for ablation cutting of a clear PI-based multi-layer stack for foldable display cover window application. …

App Note 55: Drilling and cutting of modified polyimide (MPI) and liquid crystal polymer (LCP), materials used in 5G flexible printed circuits (FPCs), are demonstrated using the IceFyre …

App Note 54: Bessel beam optics produce a short Bessel region from the output of an IceFyre^® 1064-50 picosecond laser to process thin glass & sapphire.

App Note 53: With its short pulse widths and high pulse energies, the Spirit HE 1040-16 industrial fs laser offers optimal laser parameters for processing a range of Nitinol thicknesses …

App Note 52: Using the IceFyre ps IR laser system, an optimized welding process could be developed for different material combinations.

App Note 51: Manufacturing of flexible organic light-emitting diode (OLED) displays is critical for next-generation consumer electronic devices, including foldable phones.

App Note 50: When extremely high-quality machining is required, high power fs laser ablation has become a useful alternative to conventional non-laser processes such as milling, grinding …

App Note 49: For high power UV ns material processing, the Talon® 355-45 laser delivers 45 Watts average power and >300 µJ pulse energy at 150 kHz pulse repetition frequency.

App Note 48: Some plastic materials exhibit photochemical color change only for UV wavelengths, while with IR lasers marking contrast is poor.